Patent Assignment
Reel/Frame 015447/0063
Assignment of Assignor's Interest
Recorded: 2004-12-10
Pages: 2
Assignor
HITACHI, LTD. AND HITACHI HOKKAI SEMICONDUCTOR, LTD.
Executed: 2004-10-13
Assignee
RENESAS TECHNOLOGY, CORP.
4-1, MARUNOUCH 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(2)
A Method of Manufacturing a Semiconductor Device Having a Flexible Wiring Substrate
Methods of enhancing dyeability of polymers
Application:
10/664,798 →
Publication:
US 2004/0068807
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger and Change of Name
Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Corrective Assignment to Correct the Assignment to Reflect the Transfer of Ownership Solely from Hitachi, Ltd. to Renesas Technology Corp. Previously Recorded at Reel: 015447 Frame: 0063. Assignor(S) Hereby Confirms the Assignment.
May 12, 2017
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 042452/0662 →
Merger and Change of Name
May 12, 2017
From: HITACHI HOKKAI SEMICONDUCTOR, LTD.; NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042458/0109 →
Assignment of Assignor's Interest
May 12, 2017
From: TOMIHARA, SEIICHI
To: HITACHI, LTD.; HITACHI HOKKAI SEMICONDUCTOR, LTD.
Reel/Frame 042356/0094 →
Merger
May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Change of Name
May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →