Method of manufacturing a semiconductor device having a flexible wiring substrate
View Patent ↗Peeling between a molding resin and a substrate is prevented to improve the quality of a semiconductor device. A film substrate capable of being deformed following shrinkage upon curing of a molding resin and having plural partitioned device areas is provided, then a block molding is performed so as to cover the plural device areas in a lump on a chip bearing surface side of the film substrate, and thereafter the film substrate is subjected to dicing wherein a cutting blade is advanced toward a block molding portion to divide the film substrate device area by device area in accordance with a down cutting method, whereby peeling of the substrate in the dicing work can be prevented.
1. A method of manufacturing a semiconductor device, comprising the steps of:
providing a flexible wiring substrate having a front surface, a back surface opposite from the front surface, a plurality of device areas on the front surface and a plurality of electrodes formed on each device area;
providing semiconductor chips each having a main surface, a back surface opposed of the main surface thereof and a plurality of electrodes formed on the main surface;
mounting the semiconductor chips respectively on the device areas of the front surface of the flexible wiring substrate;
connecting electrodes of the semiconductor chips with the electrodes of the flexible wiring substrate on respective device areas of the front surface of the flexible wiring substrate by means of conductive members;
sealing the semiconductor chips and the plural device areas of the front surface of the flexible wiring substrate by a resin body formed according to a block molding method; and
cutting the flexible wiring substrate and the resin body to divide them between respective device areas of the front surface of the flexible wiring substrate using a cutting blade,
wherein, in the cutting step, a rotation axis of the cutting blade is positioned over the back surface of the flexible wiring substrate, and cutting all outlines of device areas by moving the cutting blade while feeding the wiring substrate and the resin body in a same direction as rotation of the cutting blade.
2. A method of manufacturing a semiconductor device according to claim 1 , wherein, the flexible wiring substrate has a plurality of wirings respectively connected with the electrodes thereof, and
in the cutting step, the wirings of the flexible wiring substrate are cut by the cutting blade.
3. A method of manufacturing a semiconductor device according to claim 2 , wherein, the wirings of the flexible wiring substrate are formed as power supply lines for plating.
4. A method of manufacturing a semiconductor device according to claim 2 , wherein, the wiring substrate having a plurality of conductive leads formed on the back surface of each device areas, the conductive leads are electrically connected with the electrodes of corresponding device areas, and
further comprising the step of affixing solder balls on the conductive leads before the cutting step.
5. A method of manufacturing a semiconductor device according to claim 4 , further comprising the step of conducting inspection after the cutting step.
6. A method of manufacturing a semiconductor device according to claim 5 , wherein, in the mounting step, facing the back surface of the semiconductor chip to corresponding device area of the front surface of the flexible wiring substrate, and arranging the semiconductor chip as the electrodes of the flexible wiring substrate is positioned at the outside of corresponding semiconductor chips,
wherein, in the connecting step, connecting the electrodes of the semiconductor chips with the electrodes of the flexible wiring substrate by wire bonding method with a plurality of wires, and
wherein, in the sealing step, sealing connecting portions of the wires and the electrodes of the flexible wiring substrate by the resin body.
7. A method of manufacturing a semiconductor device according to claim 6 , wherein the flexible wiring substrate is comprised of a polyimide film.
8. A method of manufacturing a semiconductor device according to claim 1 , wherein, the wiring substrate having a plurality of conductive lands formed on the back surface of each device areas, the conductive lands are electrically connected with the electrodes of corresponding device areas, and
further comprising the step of affixing solder balls on the conductive lands before the cutting step.
9. A method of manufacturing a semiconductor device according to claim 8 , wherein, further comprising the step of conducting inspection after the cutting step.
10. A method of manufacturing a semiconductor device according to claim 9 , wherein, in the mounting step, facing the back surface of the semiconductor chip to a corresponding device area of the front surface of the flexible wiring substrate, and arranging the semiconductor chip as the electrodes of the flexible wiring substrate is positioned at the an outside portion of corresponding semiconductor chips,
wherein, in the connecting step, connecting the electrodes of the semiconductor chips with the electrodes of the flexible wiring substrate by a wire bonding method with a plurality of wires, and
wherein, in the sealing step, sealing connecting portions of the wires and the electrodes of the flexible wiring substrate by the resin body.
11. A method of manufacturing a semiconductor device according to claim 10 , wherein the flexible wiring substrate is comprised of a polyimide film.