Patent Assignment
Reel/Frame 042356/0094
Assignment of Assignor's Interest
Recorded: 2017-05-12
Pages: 2
Assignor
TOMIHARA, SEIICHI
Executed: 2001-08-29
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
HITACHI HOKKAI SEMICONDUCTOR, LTD.
145, AZANAKAJIMA, NANAECHO, KAMEDA-GUN, HOKKAIDO, JAPAN
Covered Property
(1)
A Method of Manufacturing a Semiconductor Device Having a Flexible Wiring Substrate
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 10, 2004
From: HITACHI, LTD. AND HITACHI HOKKAI SEMICONDUCTOR, LTD.
To: RENESAS TECHNOLOGY, CORP.
Reel/Frame 015447/0063 →
Merger and Change of Name
Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Change of Name
May 12, 2017
From: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
To: RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
Reel/Frame 042484/0880 →
Corrective Assignment to Correct the Assignment to Reflect the Transfer of Ownership Solely from Hitachi, Ltd. to Renesas Technology Corp. Previously Recorded at Reel: 015447 Frame: 0063. Assignor(S) Hereby Confirms the Assignment.
May 12, 2017
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 042452/0662 →
Merger
May 12, 2017
From: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Reel/Frame 042609/0807 →
Merger and Change of Name
May 12, 2017
From: HITACHI HOKKAI SEMICONDUCTOR, LTD.; NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 042458/0109 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →