Patent Assignment
Reel/Frame 015531/0023
Assignment of Assignor's Interest
Recorded: 2005-01-04
Pages: 5
Assignors
SCHROEDER, UWE PAUL
Executed: 2004-10-15
GOLDBACH, MATTHIAS
Executed: 2004-10-18
MONO, TOBIAS
Executed: 2004-10-19
Assignee
INFINEON TECHNOLOGIES AG
ST. MARTIN STR. 53, MUNICH, 81669, GERMANY
Covered Property
(1)
Method for Forming a Trench in a Layer or a Layer Stack on a Semiconductor Wafer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 15, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023821/0535 →
Assignment of Assignor's Interest
May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest
Oct 16, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036877/0513 →