IP Library Assignment 015534/0324
Patent Assignment
Reel/Frame 015534/0324

Assignment of Assignor's Interest

Recorded: 2004-06-29 Pages: 3
Assignor
PARK, SUNG KEE
Executed: 2004-06-02
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RIM, BUBAL-UEP, ICHON-SHI, KYUNGKI-DO,, 467-860, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Device Having Pad Structure for Preventing and Buffering Stress of Silicon Nitride Film
Patent: 7,271,439 →
Application: 10/879,840 →
Publication: US 2005/0133854
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 6, 2006
From: HYNIX SEMICONDUCTOR INC.
To: HYNIX SEMICONDUCTOR INC.; STMICROELECTRONICS S.R.L.
Reel/Frame 018207/0057 →
Assignment of Assignor's Interest Aug 10, 2015
From: NUMONYX B. V.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 036319/0139 →
Change of Name Aug 10, 2015
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 036319/0271 →