Patent Assignment
Reel/Frame 015573/0171
Assignment of Assignor's Interest
Recorded: 2004-07-12
Pages: 2
Assignor
LEE, KAE-HOON
Executed: 2004-07-11
Assignee
ANAM SEMICONDUCTOR INC.
891-10, DAECHI-DONG, KANGNAM-KU, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Forming a Bonding Pad of a Semiconductor Device Including a Plasma Treatment
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jul 11, 2005
From: ANAM SEMICONDUCTOR INC.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016504/0576 →
Change of Name
Jun 8, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017749/0335 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017749 Frame 0335. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.".
Jun 21, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017821/0670 →
Merger and Change of Name
Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name
Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →