IP Library › Assignment 016504/0576
Patent Assignment
Reel/Frame 016504/0576

Change of Name

Recorded: 2005-07-11 Pages: 5
Assignor
ANAM SEMICONDUCTOR INC.
Executed: 2004-12-21
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10 DAECHI-DONG KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF
Covered Properties (3)
Trench in Semiconductor Device and Formation Method Thereof
Patent: 7,015,114 →
Application: 10/728,699 →
Publication: US 2004/0121532
Method for Forming a Bonding Pad of a Semiconductor Device Including a Plasma Treatment
Patent: 7,250,361 →
Application: 10/889,398 →
Publication: US 2005/0009314
Semiconductor Device Employing Soi Substrate and Method of Manufacturing the Same
Patent: 7,217,602 →
Application: 10/891,626 →
Publication: US 2005/0040462
Related Assignments (11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 5, 2003
From: SEO, YOUNG-HUN
To: ANAM SEMICONDUCTOR INC.
Reel/Frame 014772/0917 →
Change of Name Jun 8, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017749/0335 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017749 Frame 0335. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.". Jun 21, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017821/0670 →
Assignment of Assignor's Interest Oct 15, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034009/0157 →
Corrective Assignment to Correct Remove Patent No. 878209 from Exhibit B Previously Recorded at Reel: 034009 Frame: 0157. Assignor(S) Hereby Confirms the Assignment. Oct 24, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034087/0097 →
Assignment of Assignor's Interest Feb 22, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041347/0602 →
Merger and Change of Name Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest Jun 23, 2021
From: INPHI CORPORATION
To: MARVELL TECHNOLOGY CAYMAN I
Reel/Frame 056649/0823 →
Assignment of Assignor's Interest Jun 25, 2021
From: MARVELL TECHNOLOGY CAYMAN I
To: CAVIUM INTERNATIONAL
Reel/Frame 057279/0519 →
Assignment of Assignor's Interest Aug 27, 2021
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE LTD.
Reel/Frame 057336/0873 →