IP Library Assignment 015618/0810
Patent Assignment
Reel/Frame 015618/0810

Assignment of Assignor's Interest

Recorded: 2005-01-24 Pages: 4
Assignor
GEYER, STEFAN
Executed: 2004-11-03
Assignee
INFINEON TECHNOLOGIES AG
ST. MARTIN STR. 53, MUNICH, 81669, GERMANY
Covered Property (1)
Wafer Level Packages for Chips with Sawn Edge Protection
Patent: 7,091,062 →
Application: 10/967,020 →
Publication: US 2005/0110156
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 15, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023853/0001 →
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest Oct 16, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036877/0513 →