Patent Assignment
Reel/Frame 015630/0405
Assignment of Assignor's Interest
Recorded: 2004-07-22
Pages: 3
Assignee
BROADCOM CORPORATION
16215 ALTON PARKWAY, IRVINE, CALIFORNIA, 92618-3616
Covered Properties
(2)
Ball Grid Array Package Fabrication with Ic Die Support Structures
Ic Die Support Structures for Ball Grid Array Package Fabrication
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 2, 2005
From: KHAN, REZA-UR R.; ZHAO, SAM Z.
To: BROADCOM CORPORATION
Reel/Frame 015721/0144 →
Patent Security Agreement
Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
Assignment of Assignor's Interest
Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
Termination and Release of Security Interest in Patents
Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
Merger
Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0097 →
Corrective Assignment to Correct the Execution Date Previously Recorded at Reel: 047196 Frame: 0097. Assignor(S) Hereby Confirms the Merger.
Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048555/0510 →