IC die support structures for ball grid array package fabrication
View Patent ↗A system and method of assembling a ball grid array (BGA) package with IC die support is described. A stiffener is attached to a substrate that includes a centrally located opening with an integrated circuit (IC) die support structure removably held therein. An IC die is mounted to a central region of the stiffener. Further assembly process steps may be performed on the BGA package with IC die support. The IC die support structure is removed from the centrally located opening. In aspects of the invention, the IC die support structure is removably held in the opening by an adhesive tape or by one or more substrate tabs.
1. A ball grid array (BGA) package with IC die support apparatus for use during assembly, comprising:
a substantially planar substrate having opposing first and second surfaces, and having an opening through said substrate in a central region that is open at said first surface and said second surface;
a stiffener having opposing first and second surfaces, said first surface of said stiffener attached to said second surface of said substrate;
an IC die mounted to said second surface of said stiffener in a central region opposite said opening through said substrate; and
an IC die support structure removably held in said opening.
2. The BGA package of claim 1 , wherein said IC die support structure is substantially co-planar with said substrate, and said IC die support structure has a thickness that is substantially equal to a thickness of said substrate.
3. The BGA package of claim 1 , wherein the IC die support structure comprises a substrate portion, the IC die support structure further comprising:
at least one breakable substrate tab that removably holds said IC die support structure in said opening; and enables said IC die support structure to be released from said opening when said at least one breakable substrate tab is broken.
4. The BGA package of claim 3 , wherein said opening, said substrate portion, and said at least one breakable substrate tab have substantially rectangular shapes.
5. The BGA package of claim 1 , further comprising:
an adhesive tape applied to said IC die support structure and said first surface of said substrate that removably holds said IC die support structure within said opening and enables said IC die support structure to be removed from said opening when said adhesive tape is detached from said substrate.
6. The BGA package of claim 1 , wherein said IC die support structure comprises a substrate material.
7. The BGA package of claim 1 , wherein said IC die support structure comprises at least one of a BT and FR4.
8. The BGA package of claim 1 , wherein said IC die support structure comprises a ceramic.
9. The BGA package of claim 1 , wherein said IC die support structure comprises at least one metal.
10. The BGA package of claim 1 , wherein said IC die support structure comprises a metal alloy.
11. The BGA package of claim 1 , wherein said IC die support structure comprises a plastic.
12. The BGA package of claim 1 , wherein said IC die support structure has a shape substantially equal to a shape of said opening.
13. The BGA package of claim 12 , wherein said IC die support structure is substantially rectangular shaped.
14. The BGA package of claim 1 , further comprising:
at least one breakable tab that removably holds said IC die support structure in said opening and enables said IC die support structure to be released from said opening when said at least one breakable tab is broken.
15. The BGA package of claim 14 , wherein said at least one breakable tab is located in a corner of said opening.
16. The BGA package of claim 14 , wherein said at least one breakable tab is located along an edge of said opening.
17. The BGA package of claim 5 , wherein said adhesive tape includes a tape having an adhesive material on at least one surface.
18. The BGA package of claim 5 , wherein said adhesive tape is configured to attach a single IC die support structure to a single substrate.
19. The BGA package of claim 5 , wherein said adhesive tape is configured to attach a plurality of IC die support structures to a plurality of substrates.
20. The BGA package of claim 1 , further comprising:
a rigid planar carrier attached to said IC die support structure and said first surface of said substrate that removably holds said IC die support structure within said opening and enables said IC die support structure to be removed from said opening when said rigid planar carrier is detached from said substrate.
21. The BGA package of claim 20 , wherein said IC die support structure is attached to said rigid planar carrier by an adhesive material.
22. The BGA package of claim 1 , wherein said IC die support structure has one of a substantially circular, elliptical, or polygonal shape.