Patent Assignment
Reel/Frame 015721/0144
Assignment of Assignor's Interest
Recorded: 2005-03-02
Pages: 3
Assignee
BROADCOM CORPORATION
16215 ALTON PARKWAY, IRVINE, CALIFORNIA, 92618-3616
Covered Property
(1)
Ic Die Support Structures for Ball Grid Array Package Fabrication
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 22, 2004
From: KHAN, REZA-UR; ZHAO, SAM ZIQUN
To: BROADCOM CORPORATION
Reel/Frame 015630/0405 →
Patent Security Agreement
Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
Assignment of Assignor's Interest
Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
Termination and Release of Security Interest in Patents
Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
Merger
Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0097 →
Corrective Assignment to Correct the Execution Date Previously Recorded at Reel: 047196 Frame: 0097. Assignor(S) Hereby Confirms the Merger.
Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048555/0510 →