Patent Assignment
Reel/Frame 015647/0046
Correction of Reel 015502 Frame 0784 Correcting Receiving Parties Address.
Recorded: 2005-02-02
Pages: 3
Assignors
AIBA, AKIHIRO
Executed: 2004-01-30
OKABE, TAKEO
Executed: 2004-01-30
SEKIGUCHI, JUNNOSUKE
Executed: 2004-01-30
Assignee
NIKKO MATERIALS COMPANY, LIMITED
10-1, TORANOMON 2-CHOME, MINATO-KU TOKYO, 105-8407, JAPAN
Covered Property
(1)
Copper Electroplating Method, Pure Copper Anode for Copper Electroplating, and Semiconductor Wafer Plated Thereby with Little Particle Adhesion
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 28, 2004
From: AIBA,ET AL AKIHIRO; OKABE, TAKEO; SEKIGUCHI, JUNNOSUKE
To: NIKKO MATERIALS COMPANY, LIMITED
Reel/Frame 015502/0784 →
Change of Name
Nov 28, 2006
From: NIKKO MATERIALS CO., LTD.
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 018555/0221 →
Change of Name/Merger
Jun 9, 2011
From: NIPPON MINING & METALS CO., LTD.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 026417/0023 →
Change of Address
Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
Change of Address
Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →