Patent Assignment
Reel/Frame 015828/0402
Assignment of Assignor's Interest
Recorded: 2004-09-22
Pages: 3
Assignors
HUEMOELLER, RONALD PATRICK
Executed: 2002-09-30
RUSLI, SUKIANTO
Executed: 2002-09-30
HINER, DAVE
Executed: 2002-09-30
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248
Covered Property
(1)
Method for Making an Integrated Circuit Substrate Having Embedded Back-Side Access Conductors and Vias
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 29, 2004
From: HINER, DAVID JON; HUEMOELLER, RONALD PATRICK; RUSLI, SUKIANTO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 016027/0179 →
Patent Security Agreement
Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →