Patent Assignment
Reel/Frame 015936/0938
Assignment of Assignor's Interest
Recorded: 2005-04-22
Pages: 4
Assignors
PARK, SOO-SAN
Executed: 2005-04-15
MIN, GAB-YONG
Executed: 2005-04-15
JEONG, JIN-WOOK
Executed: 2005-04-15
LEE, HEE BONG
Executed: 2005-04-15
LEE, JASON
Executed: 2005-04-15
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
System for Peeling Semiconductor Chips from Tape
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0343 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052938/0305 →
Corrective Assignment to Correct the Receiving Party Data from Stats Cippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded at Reel: 38378 Frame: 343. Assignor(S) Hereby Confirms the Change of Name.
May 29, 2024
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 067556/0746 →