Patent Assignment
Reel/Frame 016057/0168
Assignment of Assignor's Interest
Recorded: 2005-04-12
Pages: 4
Assignors
SHIBATA, MASATOMO
Executed: 2005-03-25
OSHIMA, YUICHI
Executed: 2005-03-25
ERI, TAKESHI
Executed: 2005-03-25
USUI, AKIRA
Executed: 2005-03-25
SUNAGAWA, HARUO
Executed: 2005-03-25
Assignees
HITACHI CABLE, LTD.
6-1 OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Porous Substrate and Fabrication Method Therefor, and Gan Series Semiconductor Layered Substrate and Fabrication Method Therefor
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Dec 19, 2014
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 034557/0622 →
Assignment of Assignor's Interest
Jan 9, 2015
From: NEC CORPORATION
To: HITACHI METALS, LTD.
Reel/Frame 034673/0419 →
Transfer to Successor by Corporate Separation
Jul 27, 2015
From: HITACHI METALS, LTD.
To: SCIOCS COMPANY LIMITED
Reel/Frame 036190/0910 →
Assignment of Assignor's Interest
Feb 8, 2016
From: SCIOCS COMPANY LIMITED
To: SUMITOMO CHEMICAL COMPANY, LIMITED
Reel/Frame 037685/0156 →