Patent Assignment
Reel/Frame 016095/0687
Corrective Assignment to Correct the the Name of the Assignee Previously Recorded on Reel 016043 Frame 0755. Assignor(S) Hereby Confirms the Corrective Assignment.
Recorded: 2005-06-06
Pages: 6
Assignee
SPANSION LLC
ONE AMD PLACE, P.O. BOX 3453, SUNNYVALE, CALIFORNIA, 94088
Covered Property
(1)
Metal/Oxide Etch After Polish to Prevent Bridging Between Adjacent Features of a Semiconductor Structure
Patent:
7,288,487 →
Application:
11/000,870 →
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 1, 2004
From: GABRIEL, CALVIN T.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 016043/0706 →
Assignment of Assignor's Interest
Dec 1, 2004
From: KANG, INKUK; KINOSHITA, HIROYUKI
To: SPANSION, LLC
Reel/Frame 016043/0755 →
Security Agreement
Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Release of Security Interest
Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Security Interest
Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
Release of Security Interest
May 17, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 042486/0315 →
Assignment of Assignor's Interest
Jun 14, 2017
From: SPANSION LLC
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 042702/0460 →
Corrective Assignment to Correct the 8647899 Previously Recorded on Reel 035240 Frame 0429. Assignor(S) Hereby Confirms the Security Interst.
Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →