Patent Assignment
Reel/Frame 016144/0918
Assignment of Assignor's Interest
Recorded: 2004-12-30
Pages: 3
Assignor
JUNG, MENG AN
Executed: 2004-12-24
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10, DAECHI-DONG,, KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 23, 2006
From: DONGBU-ANAM SEMICONDUCTOR, INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017663/0468 →
Assignment of Assignor's Interest
Jun 2, 2014
From: DONGBU HIKTEK CO., LTD.
To: STRATEGIC GLOBAL ADVISORS OF OREGON, INC.
Reel/Frame 033010/0184 →
Assignment of Assignor's Interest
Jun 10, 2014
From: STRATEGIC GLOBAL ADVISORS OF OREGON, INC.
To: INVENSAS CORPORATION
Reel/Frame 033070/0780 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →