Patent Assignment
Reel/Frame 033010/0184
Assignment of Assignor's Interest
Recorded: 2014-06-02
Pages: 8
Assignor
DONGBU HIKTEK CO., LTD.
Executed: 2014-05-25
Assignee
STRATEGIC GLOBAL ADVISORS OF OREGON, INC.
15320 SE BARON LOOP, HAPPY VALLEY, OREGON, 97086
Covered Properties
(10)
Semiconductor Device and Method for Fabricating the Same
Semiconductor Device and Method of Manufacturing a Semiconductor Device
Semiconductor Device and Fabricating Method Thereof
Semiconductor Device
Wafer Bonding Method of System in Package
Method of Forming Metal Electrode of System in Package
Semiconductor Chip, Method of Fabricating the Same and Stack Package Having the Same
Semiconductor Device and Method for Fabricating the Same
Semiconductor Chip, Method of Fabricating the Same and Semiconductor Chip Stack Package
Multi-Layered Metal Interconnection
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 10, 2014
From: STRATEGIC GLOBAL ADVISORS OF OREGON, INC.
To: INVENSAS CORPORATION
Reel/Frame 033070/0780 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0745 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073941/0814 →