Patent Assignment
Reel/Frame 016181/0916
Assignment of Assignor's Interest
Recorded: 2005-06-25
Pages: 3
Assignors
SHIM, IL KWON
Executed: 2005-05-04
PUNZALAN, JEFFREY D.
Executed: 2005-05-04
LAU, KENG KIAT
Executed: 2005-05-04
Assignee
ST ASSEMBLY TEST SERVICES LTD.
5 YISHUN ST. 23, SINGAPORE 768442, SINGAPORE
Covered Property
(1)
Large Die Package and Method for the Fabrication Thereof
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Receiving Party Data Previously Recorded on Reel 016181 Frame 0916. Assignor(S) Hereby Confirms the Corrective Assignment to Re-Record Assignment Previously Recorded Under Reel and Frame 016181/0916.
Aug 23, 2005
From: SHIM, IL KWON; PUNZALAN, JEFFREY D.; LAU, KENG KIAT
To: STATS CHIPPAC LTD.
Reel/Frame 016434/0225 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0319 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052938/0305 →
Correct Error in Assignment Name from Stats Chippac, Pte. Lte to Stats Chippac Pte. Ltd (Reel: 038378 Frame: 0319)
Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064760/0986 →