IP Library Assignment 016307/0344
Patent Assignment
Reel/Frame 016307/0344

Assignment of Assignor's Interest

Recorded: 2005-06-07 Pages: 4
Assignors
RINNE, GLENN A.
Executed: 2005-06-02
MIS, DANIEL
Executed: 2005-06-02
Assignee
UNITIVE INTERNATIONAL LIMITED
CARACASBAAIWEG 201, CURACAO, NETHERLANDS ANTILLES
Covered Property (1)
Methods of Forming Bumps Using Barrier Layers as Etch Masks
Patent: 7,427,557 →
Application: 11/075,474 →
Publication: US 2005/0215045
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Effective 11/01/2012 Jan 9, 2013
From: UNITIVE INTERNATIONAL, LTD.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 029597/0452 →
Patent Security Agreement May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →