IP Library › Assignment 016352/0577
Patent Assignment
Reel/Frame 016352/0577

Assignment of Assignor's Interest

Recorded: 2005-03-14 Pages: 3
Assignor
CHO, IHL HYUN
Executed: 2005-01-05
Assignee
MANGNACHIP SEMICONDUCTOR, LTD.
1, HYANGJEONG-DONG, HUNGDUK-GU, CHEONGJU-SI, CHUNGCHEONGBUK-DO, 361-725, KOREA, REPUBLIC OF
Covered Property (1)
Method of Forming Metal Wiring for High Voltage Element
Patent: 7,452,802 →
Application: 11/030,786 →
Publication: US 2005/0153549
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 6, 2005
From: CHO, IHL HYUN
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 017098/0762 →
After-Acquired Intellectual Property Kun-Pledge Agreement Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Release of Security Interest Aug 12, 2013
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 030988/0419 →
Assignment of Assignor's Interest Sep 3, 2020
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: KEY FOUNDRY CO., LTD.
Reel/Frame 053703/0227 →
Change of Name Mar 12, 2024
From: KEY FOUNDRY CO., LTD.
To: SK KEYFOUNDRY INC.
Reel/Frame 066794/0290 →