IP Library › Assignment 016394/0929
Patent Assignment
Reel/Frame 016394/0929

Assignment of Assignor's Interest

Recorded: 2005-03-17 Pages: 2
Assignors
LU, SZU WEI
Executed: 2005-03-10
LEE, HSIN-HUI
Executed: 2005-03-10
WANG, CHUNG YU
Executed: 2005-03-10
LII, MIRNG-JI
Executed: 2005-03-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, ROC 300-77, TAIWAN
Covered Property (1)
Reducing Cracking of High-Lead or Lead-Free Bumps by Matching Sizes of Contact Pads and Bump Pads
Patent: 7,361,990 →
Application: 11/082,298 →
Publication: US 2006/0220244
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 1, 2020
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: MICROSOFT TECHNOLOGY LICENSING, LLC.
Reel/Frame 054509/0049 →