Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads
View Patent ↗A semiconductor package assembly comprises a first conductive pad on a semiconductor substrate; a second conductive pad on a package substrate; a bump physically coupled between the first conductive pad and the second conductive pad, wherein the bump is substantially lead-free or high-lead-containing; the bump has a first interface with the first conductive pad, the first interface having a first linear dimension; the bump has a second interface with the second conductive pad, the second interface having a second linear dimension; and wherein the ratio of the first linear dimension and the second linear dimension is between about 0.7 and about 1.7.
1. A semiconductor package assembly comprising:
a first conductive pad on a semiconductor substrate;
a second conductive pad on a package substrate;
a substantially lead-free bump physically coupled between the first conductive pad and the second conductive pad;
wherein the bump has a first interface with the first conductive pad, the first interface having a first linear dimension;
wherein the bump has a second interface with the second conductive pad, the second interface having a second linear dimension, and wherein the first and the second linear dimensions are between about 30 μm and 200 μm, respectively; and
wherein the first linear dimension and the second linear dimension has a ratio of between about 0.7 and about 1.7.
2. The semiconductor package assembly of claim 1 wherein the semiconductor substrate comprises at least one low-k dielectric layer having a k value of less than about 3.3.
3. The semiconductor package assembly of claim 1 wherein the bump comprises less than about 5 percent lead.
4. The semiconductor package assembly of claim 1 wherein the ratio of the first linear dimension and the second linear dimension is between about 0.8 and about 1.5.
5. The semiconductor package assembly of claim 4 wherein the ratio of the first linear dimension and the second linear dimension is between about 0.9 and about 1.3.
6. The semiconductor package assembly of claim 1 wherein the second conductive pad comprises a material selected from the group consisting essentially of copper, aluminum, and combinations thereof.
7. The semiconductor package assembly of claim 1 wherein the second conductive pad is a protecting layer comprising a material selected from the group consisting essentially of nickel, gold and combinations thereof.
8. The semiconductor package assembly of claim 1 further comprising a plurality of bumps between the semiconductor substrate and the package substrate wherein the bumps have a pitch of between about 100 μm and about 300 μm.
9. The semiconductor package assembly of claim 1 wherein the bump has a height of between about 30 μm and about 200 μm, wherein the height and the first linear dimension has a ratio of between about 0.5 and about 1.0, and wherein the height and the second linear dimension has a ratio of between about 0.5 and about 1.0.
10. The semiconductor package assembly of claim 1 wherein the first conductive pad is an under bump metallization (UBM).
11. The semiconductor package assembly of claim 1 further comprising a plurality of ball grid array (BGA) balls on a surface of the package substrate, wherein the BGA balls comprise a material selected from the group consisting essentially of an eutectic alloy and a material with lead concentration of less than about 5 percent.
12. A semiconductor package assembly comprising:
a first conductive pad on a semiconductor substrate;
a second conductive pad on a package substrate;
a substantially lead-free bump physically coupled between the first conductive pad and the second conductive pad, wherein the bump has a height of between about 30 μm and about 200 μm;
wherein the bump has a first interface with the first conductive pad, the first interface having a first linear dimension;
wherein the bump has a second interface with the second conductive pad, the second interface having a second linear dimension, and wherein ratios of the height to the first and the second linear dimensions are between about 0.5 and about 1.0; and
wherein the first linear dimension and the second linear dimension has a ratio of between about 0.7 and about 1.7.
13. The semiconductor package assembly of claim 12 wherein the bump comprises less than about 5 percent lead.
14. The semiconductor package assembly of claim 12 wherein the ratio of the first linear dimension and the second linear dimension is between about 0.8 and about 1.5.
15. The semiconductor package assembly of claim 12 wherein the ratio of the first linear dimension and the second linear dimension is between about 0.9 and about 1.3.