Patent Assignment
Reel/Frame 054509/0049
Assignment of Assignor's Interest
Recorded: 2020-12-01
Pages: 5
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Executed: 2020-11-19
Assignee
MICROSOFT TECHNOLOGY LICENSING, LLC.
ONE MICROSOFT WAY, REDMOND, WASHINGTON, 98052
Covered Properties
(6)
Reducing Cracking of High-Lead or Lead-Free Bumps by Matching Sizes of Contact Pads and Bump Pads
Dummy via for Reducing Proximity Effect and Method of Using the Same
Method for Reshaping Silicon Surfaces with Shallow Trench Isolation
Metal Structure for Memory Device
Method for Reshaping Silicon Surfaces with Shallow Trench Isolation
Metal Structure for Memory Device
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 17, 2005
From: LU, SZU WEI; LEE, HSIN-HUI; WANG, CHUNG YU; LII, MIRNG-JI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 016394/0929 →
Assignment of Assignor's Interest
Mar 24, 2005
From: HUANG, KUN-CHENG; TSENG, H.C.; YOU, JC; LIU, K.M.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 016411/0900 →
Assignment of Assignor's Interest
Jul 19, 2007
From: WANG, YU-HSIUNG; CHU, WEN-TING; CHEN, ERIC; CHIN, HSIEN-WEI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 019578/0519 →
Assignment of Assignor's Interest
Feb 23, 2009
From: LIAW, JHON JHY
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 022295/0353 →
Assignment of Assignor's Interest
May 1, 2013
From: LIAW, JHON JHY
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 030328/0838 →
Corrective Assignment to Correct the Last Names of Inventors 2-6 Previously Recorded on Reel 016411 Frame 0900. Assignor(S) Hereby Confirms the Last Names of Inventors 2-6 Is Correct as Shown.
Aug 18, 2020
From: HUANG, KUN-CHENG; TSENG, HUAN-CHI; YOU, JHY-CHEN; LIU, KUAN-MIAO
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 053528/0350 →