IP Library › Assignment 019578/0519
Patent Assignment
Reel/Frame 019578/0519

Assignment of Assignor's Interest

Recorded: 2007-07-19 Pages: 3
Assignors
WANG, YU-HSIUNG
Executed: 2007-06-29
CHU, WEN-TING
Executed: 2007-06-29
CHEN, ERIC
Executed: 2007-06-29
CHIN, HSIEN-WEI
Executed: 2007-06-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Method for Reshaping Silicon Surfaces with Shallow Trench Isolation
Patent: 8,124,494 →
Application: 11/778,558 →
Publication: US 2009/0023255
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 1, 2020
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: MICROSOFT TECHNOLOGY LICENSING, LLC.
Reel/Frame 054509/0049 →