Patent Assignment
Reel/Frame 016430/0472
Corrective Assignment to Correct the Receiving Party Data Previously Recorded on Reel 016181 Frame 0905. Assignor(S) Hereby Confirms the Corrective Assignment to Re-Record Assignment Previously Recorded Under Reel and Frame 016181/0905.
Recorded: 2005-08-22
Pages: 4
Assignors
SHIM, IL KWON
Executed: 2005-04-28
ALVAREZ, SHEILA MARIE L.
Executed: 2005-04-28
ALVAREZ, ROMEO EMMANUEL P.
Executed: 2005-04-28
Assignee
STATS CHIPPAC LTD.
5 YISHUN ST. 23, SINGAPORE 768442, SINGAPORE
Covered Property
(1)
Semiconductor Package with Selective Underfill and Fabrication Method Therfor
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 25, 2005
From: SHIM, IL KWON; ALVAREZ, SHEILA MARIE L.; ALVAREZ, ROMEO EMMANUEL P.
To: ST ASSEMBLY TEST SERVICES LTD.
Reel/Frame 016181/0905 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0343 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052938/0305 →
Corrective Assignment to Correct the Receiving Party Data from Stats Cippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded at Reel: 38378 Frame: 343. Assignor(S) Hereby Confirms the Change of Name.
May 29, 2024
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 067556/0746 →