IP Library › Assignment 016513/0728
Patent Assignment
Reel/Frame 016513/0728

Assignment of Assignor's Interest

Recorded: 2005-07-13 Pages: 2
Assignor
MITSUBISHI DENKI KABUSHIKI KAISHA
Executed: 2005-06-10
Assignee
RENESAS TECHNOLOGY CORP.
2-4-1, MARUNOUCHI, CHIYODA-KU, TOKYO 100-6334, JAPAN
Covered Property (1)
Method for Laminating and Mounting Semiconductor Chip
Patent: 6,803,253 →
Application: 10/000,020 →
Publication: US 2002/0106831
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Merger Jul 12, 2013
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 030783/0796 →
Assignment of Assignor's Interest Jul 12, 2013
From: NEC CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 030783/0873 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →