Patent Assignment
Reel/Frame 016587/0218
Assignment of Assignor's Interest
Recorded: 2005-05-20
Pages: 3
Assignors
YOSHIZAWA, CHIE
Executed: 2005-04-19
UEMATSU, SATOSHI
Executed: 2005-04-19
MASHIYAMA, HISASHI
Executed: 2005-04-19
TANI, TAKEHIKO
Executed: 2005-04-19
Assignee
HITACHI CABLE, LTD.
6-1, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Grinding Abrasive Grains, Abrasive, Abrasive Solution, Abrasive Solution Preparation Method, Grinding Method, and Semiconductor Device Fabrication Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Jan 29, 2014
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 032134/0723 →
Corporate Separation
Jul 29, 2015
From: HITACHI METALS, LTD.
To: SCIOCS COMPANY LIMITED
Reel/Frame 036206/0031 →
Assignment of Assignor's Interest
Mar 2, 2016
From: SCIOCS COMPANY LIMITED
To: SUMITOMO CHEMICAL COMPANY, LIMITED
Reel/Frame 037869/0437 →