Patent Assignment
Reel/Frame 037869/0437
Assignment of Assignor's Interest
Recorded: 2016-03-02
Pages: 5
Assignor
SCIOCS COMPANY LIMITED
Executed: 2016-01-20
Assignee
SUMITOMO CHEMICAL COMPANY, LIMITED
27-1, SHINKAWA 2-CHOME, CHUO-KU, TOKYO, 104-8260, JAPAN
Covered Properties
(20)
Process for Producing Gallium Nitride Crystal Substrate, and Gallium Nitride Crystal Substrate
Iii-V Group Nitride System Semiconductor Substrate
Si-Doped Gaas Single Crystal Substrate
Vapor Phase Growth Apparatus
Grinding Abrasive Grains, Abrasive, Abrasive Solution, Abrasive Solution Preparation Method, Grinding Method, and Semiconductor Device Fabrication Method
Method of Making Nitride-Based Compound Semiconductor Crystal and Substrate
Group Iii-V Nitride-Based Semiconductor Substrate and Method of Making Same
Light Emitting Diode and Method for Fabricating Same
Iii Group Nitride Semiconductor Substrate, Substrate for Group Iii Nitride Semiconductor Device, and Fabrication Methods Thereof
Semiconductor Light-Emitting Device
Nitride-Based Semiconductor Substrate, Method of Making the Same and Epitaxial Substrate for Nitride-Based Semiconductor Light Emitting Device
Nitride Semiconductor Free-Standing Substrate
Light Emitting Diode
Field-Effect Transistor and Method of Making Same
Vapor Phase Growth Apparatus
Group Iii-V Nitride-Based Semiconductor Substrate, Group Iii-V Nitride-Based Device and Method of Fabricating the Same
Group Iii Nitride Semiconductor Substrate Production Method, and Group Iii Nitride Semiconductor Substrate
Group Iii Nitride Semiconductor Substrate, Substrate for Group Iii Nitride Semiconductor Device, and Methods of Making Same
Epitaxial Wafer, Light-Emitting Element, Method of Fabricating Epitaxial Wafer and Method of Fabricating Light-Emitting Element
Nitride Semiconductor Epitaxial Wafer and Nitride Semiconductor Device
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger
Dec 2, 2013
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 031698/0878 →
Merger
Jan 29, 2014
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 032134/0723 →
Merger
Dec 23, 2014
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 034578/0236 →
Corporate Separation
Jul 29, 2015
From: HITACHI METALS, LTD.
To: SCIOCS COMPANY LIMITED
Reel/Frame 036206/0031 →
Assignment of Assignor's Interest
Feb 29, 2016
From: NEC CORPORATION
To: SCIOCS COMPANY LIMITED
Reel/Frame 037852/0796 →