Group III nitride semiconductor substrate production method, and group III nitride semiconductor substrate
View Patent ↗A group III nitride semiconductor substrate production method includes preparing a bulk crystal formed of a group III nitride semiconductor single crystal. The group III nitride semiconductor single crystal has one crystalline plane and an other crystalline plane. Hardness of the other crystalline plane is smaller than hardness of the one crystalline plane. The prepared bulk crystal is cut from the other crystalline plane to the one crystalline plane of the bulk crystal.
1. A group III nitride semiconductor substrate production method, comprising:
preparing a bulk crystal comprising a group III nitride semiconductor single crystal, the group III nitride semiconductor single crystal comprising one crystalline face and an other crystalline face, a hardness of the other crystalline face being softer than a hardness of the one crystalline face; and
cutting the prepared bulk crystal, in a cutting direction, from the other crystalline face to the one crystalline face of the bulk crystal, wherein the cutting is performed at an angle from not less than 0 to not more than 45 degrees between the cutting direction and the [0 0 0 1] direction, wherein the damaged layer depth caused by the cutting positioned in a surface of the group III nitride semiconductor substrate exposed after the cutting is not more than 50 μm from the surface.
2. The method according to claim 1 , wherein the cutting is performed by cutting the bulk crystal at a speed of not less than 2 mm/h.
3. A group III nitride semiconductor substrate formed by cutting a group III nitride semiconductor single crystal, comprising:
a bulk crystal comprising the group III nitride semiconductor single crystal, the group III nitride semiconductor single crystal comprising one crystalline face and an other crystalline face, a hardness of the other crystalline face being softer than a hardness of the one crystalline face,
wherein the bulk crystal is cut from the other crystalline face to the one crystalline face of the bulk crystal, and the cutting is performed at an angle from not less than 0 to not more than 45 degrees between the cutting direction and the [0 0 0 1] direction, wherein the damaged layer depth caused by the cutting positioned in a surface of the group III nitride semiconductor substrate exposed after the cutting is not more than 50 μm from the surface.
4. The group III nitride semiconductor substrate according to claim 3 , wherein the absolute value of a difference between one surface roughness of a ground surface, exposed after grinding the damaged layer, in one direction parallel to the ground surface and the other surface roughness of the ground surface in another direction different from the one direction is not more than 10 nm.
5. The group III nitride semiconductor substrate according to claim 4 , wherein the crystalline orientation distribution in the ground surface is not more than a central value ±0.05°.
6. The group III nitride semiconductor substrate according to claim 5 , wherein the cutting is performed by a wire saw containing iron, and the iron concentration in the substrate is not more than 1×10 16 cm −3 .