Patent Assignment
Reel/Frame 016660/0646
Assignment of Assignor's Interest
Recorded: 2005-06-06
Pages: 2
Assignor
RYU, SANG-WOOK
Executed: 2005-03-31
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
1 HYANGJEONG-DONG, HEUNGDUK-GU, CHEONGJU-SI, CHUNGCHEONGBUK-DO, 361-725, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Removing Photoresist Layer and Method for Forming Metal Line in Semiconductor Device Using the Same
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
After-Acquired Intellectual Property Kun-Pledge Agreement
Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Release of Security Interest
Jun 22, 2010
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 024563/0807 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 024563 Frame: 0807. Assignor(S) Hereby Confirms the Release by Secured Party.
Nov 25, 2014
From: US BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 034469/0001 →
Assignment of Assignor's Interest
Sep 3, 2020
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: KEY FOUNDRY CO., LTD.
Reel/Frame 053703/0227 →
Change of Name
Mar 12, 2024
From: KEY FOUNDRY CO., LTD.
To: SK KEYFOUNDRY INC.
Reel/Frame 066794/0290 →