Patent Assignment
Reel/Frame 016698/0296
Assignment of Assignor's Interest
Recorded: 2005-06-15
Pages: 3
Assignee
LEICA MICROSYSTEMS SEMICONDUCTOR GMBH
ERNST-LEITZ-STRASSE 17-37, WETZLAR, 35578, GERMANY
Covered Property
(1)
Method and system for inspecting a wafer WITH TELECENTRIC ILLUMINATION
Application:
11/153,646 →
Publication:
US 2005/0280808
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 29, 2006
From: LEICA MICROSYSTEMS SEMICONDCTOR GMBH
To: VISTEC SEMICONDUCTOR SYSTEMS GMBH
Reel/Frame 017846/0823 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017846 Frame 0823. Assignor(S) Hereby Confirms the Change of Name
Jul 20, 2006
From: LEICA MICROSYSTEMS SEMICONDUCTOR GMBH
To: VISTEC SEMICONDUCTOR SYSTEMS GMBH
Reel/Frame 018026/0297 →
Change of Address
Jul 12, 2007
From: VISTEC SEMICONDUCTOR SYSTEMS GMBH
To: VISTEC SEMICONDUCTOR SYSTEMS GMBH
Reel/Frame 019541/0634 →