Patent Assignment
Reel/Frame 016700/0301
Assignment of Assignor's Interest
Recorded: 2005-08-31
Received: 2005-08-31
Pages: 8
Assignor
EKC TECHNOLOGY, INC.
Executed: 2005-08-23
Assignee
DUPONT AIR PRODUCTS NANOMATEIRALS L.L.C.
2507 WEST ERIE DRIVE, TEMPE, AZ, 85282, UNITED STATES
Covered Properties
(20)
Compositions and Methods for Rapidly Removing Overfilled Substrates
Application:
10/984,820 →
Chemical mechanical polishing slurries and cleaners containing salicylic acid as a corrosion inhibitor
Application:
10/980,271 →
Chemical-mechanical planarization using ozone
Application:
10/783,651 →
Photon violation spectroscopy
Application:
60/533,064 →
Method of chemically mechanically polishing substrates
Application:
60/515,450 →
Cmp Method for Copper, Tungsten, Titanium, Polysilicon, and Other Substrates Using Organosulfonic Acids as Oxidizers
Application:
10/690,623 →
Particulate or Particle-Bound Chelating Agents
Application:
10/690,626 →
Abrasive-free chemical mechanical polishing composition and polishing process containing same
Application:
10/689,043 →
Chemical Mechanical Polishing Composition and Process
Application:
10/683,730 →
Compositions for Chemical Mechanical Planarization of Tantalum and Tantalum Nitride
Application:
10/665,417 →
Catalytic Composition for Chemical-Mechanical Polishing, Method of Using Same, and Substrate Treated with Same
Application:
10/619,708 →
Composition for Chemical-Mechanical Polishing and Method of Using Same
Application:
10/619,901 →
Chemical Mechanical Polishing Composition and Process
Application:
10/401,405 →
Fenton's reagent composition for chemical-mechanical polishing, method of using same, and substrate treated with same
Application:
10/393,542 →
Catalyst Attached to Solid and Used to Promote Free Radical Formation in Cmp Formulations
Application:
10/361,822 →
Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates
Application:
10/057,206 →
Compositions for Chemical Mechanical Planarization of Copper
Application:
10/017,934 →
Chemical mechanical polishing compositions
Application:
09/985,870 →
Compositions for Chemical Mechanical Planarization of Tantalum and Tantalum Nitride
Application:
09/965,233 →
Chemical-Mechanical Planarization Using Ozone
Application:
09/783,069 →