IP Library Assignment 016759/0922
Patent Assignment
Reel/Frame 016759/0922

Assignment of Assignor's Interest

Recorded: 2005-09-09 Pages: 3
Assignors
REISS, MARTIN
Executed: 2005-06-22
LEGEN, ANTON
Executed: 2005-07-11
CARMONA, MANUEL
Executed: 2005-07-27
NOCKE, KERSTIN
Executed: 2005-06-22
Assignee
INFINEON TECHNOLOGIES AG
ST. MARTIN STR. 53, MUNICH, 81669, GERMANY
Covered Property (1)
Substrate-Based Housing Component with a Semiconductor Chip
Patent: 7,256,070 →
Application: 11/155,317 →
Publication: US 2006/0049503
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 14, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023806/0001 →
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest Oct 19, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036888/0745 →