Patent Assignment
Reel/Frame 016768/0081
Assignment of Assignor's Interest
Recorded: 2005-11-12
Pages: 4
Assignors
HA, JONG-WOO
Executed: 2005-10-31
LEE, MYUNG KIL
Executed: 2005-11-07
KIM, HYUN UK
Executed: 2005-11-07
JUNG, TAEBOK
Executed: 2005-11-07
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Stacked Die Package System
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 29, 2010
From: HA, JONG-WOO; LEE, MYUNG KIL; KIM, HYUN UK; JUNG, TAEBOK
To: STATS CHIPPAC LTD.
Reel/Frame 024312/0145 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0343 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052938/0305 →
Corrective Assignment to Correct the Receiving Party Data from Stats Cippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded at Reel: 38378 Frame: 343. Assignor(S) Hereby Confirms the Change of Name.
May 29, 2024
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 067556/0746 →