Patent Assignment
Reel/Frame 016775/0852
Assignment of Assignor's Interest
Recorded: 2005-11-14
Pages: 3
Assignors
ONG, YOU YANG
Executed: 2005-11-08
BINTI ZUKIFFLY, ZURINA
Executed: 2005-11-08
BIN EMBONG, SAAT SHUKRI
Executed: 2005-10-28
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Hyper Thermally Enhanced Semiconductor Package System Comprising Heat Slugs on Opposite Surfaces of a Semiconductor Chip
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0280 →
Release of Security Interest
Jun 8, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052864/0057 →
Correct Error in Assignment Name from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. (Reel: 38378 Frame: 0280)
Aug 31, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 064789/0474 →
Corrective Assignment to Correct the Receiving Party Name Previously Recorded at Reel: 064789 Frame: 0474 Assignor(S) Hereby Confirms the Change of Name.
Sep 8, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064842/0046 →