Patent Assignment
Reel/Frame 016782/0234
Assignment of Assignor's Interest
Recorded: 2005-07-16
Pages: 4
Assignors
GREENE, BRIAN JOSEPH
Executed: 2005-06-07
PANDA, SIDDHARTHA
Executed: 2005-06-07
ROVEDO, NIVO
Executed: 2005-06-07
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION (IBM)
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Method to Engineer Etch Profiles in Si Substrate for Advanced Semiconductor Devices
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 16, 2005
From: CHONG, YUNG FU
To: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
Reel/Frame 016782/0230 →
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Assignment of Assignor's Interest
Jul 2, 2019
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049669/0775 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →