IP Library › Assignment 016837/0830
Patent Assignment
Reel/Frame 016837/0830

Assignment of Assignor's Interest

Recorded: 2005-09-22 Pages: 2
Assignors
KUHMANN, JOCHEN
Executed: 2005-08-10
HESCHEL, MATTHIAS
Executed: 2005-08-10
Assignee
HYMITE A/S
DTU, BLDG. 325, DK-2800 KGS. LYNGBY, DENMARK
Covered Property (1)
Method of fabrication for chip scale package for a micro component
Patent: 7,419,853 →
Application: 11/202,478 →
Publication: US 2007/0035001
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 30, 2010
From: HYMITE A/S
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025403/0566 →
Assignment of Assignor's Interest Sep 3, 2015
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: CHIP STAR LTD.
Reel/Frame 036543/0245 →
Merger Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0930 →