Patent Assignment
Reel/Frame 016858/0354
Assignment of Assignor's Interest
Recorded: 2005-02-25
Pages: 3
Assignors
VASQUEZ, RAMIL N.
Executed: 2004-12-17
ABADILLA, ESTEBAN L.
Executed: 2004-12-17
ROGADO, ALEXANDER M.
Executed: 2004-12-20
LICTAO, CRISPULO, JR.
Executed: 2005-01-03
Assignee
KONINKLIJKE PHILIPS ELECTRONICS N.V.
GROENEWOUDSEWEG 1, EINDHOVEN, 5621 BA, NETHERLANDS
Covered Property
(1)
Wedge-Bonding of Wires in Electronic Device Manufacture with Reversible Wedge Bonding Tool
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
Confirmatory Assignment
Mar 26, 2012
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 027931/0502 →
Assignment of Assignor's Interest
Apr 16, 2012
From: NXP B.V.
To: SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY
Reel/Frame 028049/0649 →
Merger
Jan 6, 2016
From: SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY
To: XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY
Reel/Frame 037421/0685 →