IP Library Assignment 027931/0502
Patent Assignment
Reel/Frame 027931/0502

Confirmatory Assignment

Recorded: 2012-03-26 Pages: 5
Assignor
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, 5656 AG, NETHERLANDS
Covered Properties (8)
Method of and Device for Packaging Electronic Components Thus Packaged
Patent: 7,340,872 →
Application: 10/497,644 →
Publication: US 2005/0035025
Wedge-Bonding of Wires in Electronic Device Manufacture with Reversible Wedge Bonding Tool
Patent: 7,413,108 →
Application: 10/525,594 →
Publication: US 2005/0258215
Semiconductor Device, Semiconductor Body and Method of Manufacturing Thereof
Patent: 7,196,409 →
Application: 10/548,297 →
Publication: US 2006/0202327
Module Base Unit with Strain Relief Means
Patent: 7,733,657 →
Application: 11/572,871 →
Publication: US 2009/0190314
Electronic Device Comprising an Integrated Circuit
Patent: 7,545,026 →
Application: 11/632,518 →
Publication: US 2008/0191361
Electronic Device Comprising an Integrated Circuit and a Capacitance Element
Patent: 7,750,436 →
Application: 11/632,887 →
Publication: US 2009/0014831
Device for Packaging an Electronic Component
Patent: 7,823,369 →
Application: 12/018,089 →
Publication: US 2008/0127610
Electronic Device Comprising an Integrated Circuit and a Capacitance Element
Patent: 8,097,521 →
Application: 12/815,954 →
Publication: US 2010/0251542
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 4, 2004
From: BOSCH, JOHANNES WILHELMUS DOROTHEUS
To: KONINKLIJKE PHILIPS ELECTRONCIS N.V.
Reel/Frame 016023/0062 →
Assignment of Assignor's Interest Feb 25, 2005
From: VASQUEZ, RAMIL N.; ABADILLA, ESTEBAN L.; ROGADO, ALEXANDER M.; LICTAO, CRISPULO, JR.
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 016858/0354 →
Assignment of Assignor's Interest Sep 6, 2005
From: OUDEN, JOSEPHUS D.
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 017749/0418 →
Assignment of Assignor's Interest Mar 12, 2007
From: REINHARD, FRITZ; SCHAFFLER, GERALD; SCHOBER, JOACHIM
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 018998/0225 →
Assignment of Assignor's Interest Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
Assignment of Assignor's Interest Nov 5, 2007
From: SIX, JEAN-CLAUDE G.
To: NXP B.V.
Reel/Frame 020069/0504 →
Assignment of Assignor's Interest Jun 27, 2008
From: VAN LAMMEREN, JOOP
To: NXP B.V.
Reel/Frame 021163/0087 →
Assignment of Assignor's Interest Dec 8, 2011
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 027349/0742 →
Assignment of Assignor's Interest Dec 8, 2011
From: VAN LAMMEREN, JOOP
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 027347/0352 →
Corrective Assignment to Correct the Error in Receiving Party Data on the Cover Sheet Previously Recorded on Reel 021163 Frame 0087. Assignor(S) Hereby Confirms the Receiving Party Should Be Changed from Nxp B.V. to Koninklijke Philips Electronics N.V.. Dec 8, 2011
From: VAN LAMMEREN, JOOP
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 027347/0923 →
Assignment of Assignor's Interest Mar 12, 2012
From: BOSCH, JOHANNES WILHELMUS DOROTHEUS
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 027847/0771 →
Corrective Assignment to Correct the Name of the Assignee (Given as "Nxp B.V.") on the Recordation Cover Sheet Previously Recorded on Reel 020069 Frame 0504. Assignor(S) Hereby Confirms the Assignee Is "Koninklijke Philips Electronics N.V.", as Given on the Inventor's Assignment. Mar 12, 2012
From: SIX, JEAN-CLAUDE G.
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 027850/0654 →
Corrective Assignment to Correct the Inventor's Name as Set Out on the Recordation Cover Sheet Previously Recorded on Reel 017749 Frame 0418. Assignor(S) Hereby Confirms the Inventor's Full Name Is "Josephus Adrianus Augustinus Den Ouden" as Set Forth on the Recorded Assignment. Mar 12, 2012
From: DEN OUDEN, JOSEPHUS ADRIANUS AUGUSTINUS
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 027850/0651 →
Confirmatory Assignment Mar 26, 2012
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 027931/0507 →
Substitute Assignment Mar 27, 2012
From: FRITZ, REINHARD; SCHAFFLER, GERALD; SCHOBER, JOACHIM
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 027936/0224 →
Assignment of Assignor's Interest Apr 16, 2012
From: NXP B.V.
To: SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY
Reel/Frame 028049/0649 →
Merger Jan 6, 2016
From: SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY
To: XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY
Reel/Frame 037421/0685 →
Security Agreement Supplement Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
Corrective Assignment to Correct the Remove Application 12092129 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
Patent Release Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement. May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
Release of Security Interest Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 042762 Frame 0145. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →