IP Library Assignment 016860/0009
Patent Assignment
Reel/Frame 016860/0009

Assignment of Assignor's Interest

Recorded: 2005-10-07 Pages: 3
Assignors
NAKAMURA, NAOTO
Executed: 2005-05-12
NAKAMURA, IWAO
Executed: 2005-05-20
ISHIGURO, KENICHI
Executed: 2005-05-23
NAKASHIMA, SADAO
Executed: 2005-05-20
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-20, 3-CHOME, HIGASHI-NAKANO, NAKANO-KU, TOKYO, JAPAN
Covered Property (1)
Thermal Treatment Apparatus, Method for Manufacturing Semiconductor Device, and Method for Manufacturing Substrate
Patent: 7,667,301 →
Application: 10/528,069 →
Publication: US 2007/0194411
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 10, 2006
From: NAKAMURA, NAOTO; NAKAMURA, IWAO; SHIMADA, TOMOHARU; ISHIGURO, KENICHI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 017908/0116 →
Record to Correct Assignee Address on an Assignment Document Previously Recorded on 07/10/06, Reel 017908/Frame 0116 Dec 12, 2006
From: NAKAMURA, NAOTO; NAKAMURA, IWAO; SHIMADA, TOMOHARU; ISHIGURO, KENICHI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 018623/0485 →
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →