IP Library Assignment 018623/0485
Patent Assignment
Reel/Frame 018623/0485

Record to Correct Assignee Address on an Assignment Document Previously Recorded on 07/10/06, Reel 017908/Frame 0116

Recorded: 2006-12-12 Pages: 5
Assignors
NAKAMURA, NAOTO
Executed: 2006-06-27
NAKAMURA, IWAO
Executed: 2006-06-27
SHIMADA, TOMOHARU
Executed: 2006-06-17
ISHIGURO, KENICHI
Executed: 2006-06-27
NAKASHIMA, SADAO
Executed: 2006-06-28
Assignee
HITACHI KOKUSAI ELECTRIC INC.
4-14-1 SOTOKANDA, CHIYODA-KU, TOKYO 101-8980, JAPAN
Covered Property (1)
Thermal Treatment Apparatus, Method for Manufacturing Semiconductor Device, and Method for Manufacturing Substrate
Patent: 7,667,301 →
Application: 10/528,069 →
Publication: US 2007/0194411
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 7, 2005
From: NAKAMURA, NAOTO; NAKAMURA, IWAO; ISHIGURO, KENICHI; NAKASHIMA, SADAO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 016860/0009 →
Assignment of Assignor's Interest Jul 10, 2006
From: NAKAMURA, NAOTO; NAKAMURA, IWAO; SHIMADA, TOMOHARU; ISHIGURO, KENICHI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 017908/0116 →
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →