Patent Assignment
Reel/Frame 016917/0905
Assignment of Assignor's Interest
Recorded: 2005-10-20
Pages: 3
Assignor
DOSSI, ROBERTO
Executed: 2005-10-06
Assignee
INFINEON TECHNOLOGIES FLASH GMBH & CO. KG
KOENIGSBRUECKERSTR. 180, DRESDEN, 01099, GERMANY
Covered Property
(1)
Semiconductor Package Based on Lead-on-Chip Architecture, the Fabrication Thereof and a Leadframe for Implementing in a Semiconductor Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 14, 2010
From: INFINEON TECHNOLOGIES FLASH GMBH & CO. KG
To: QIMONDA AG
Reel/Frame 023806/0393 →
Assignment of Assignor's Interest
May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest
Sep 28, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036701/0926 →