Patent Assignment
Reel/Frame 016995/0879
Assignment of Assignor's Interest
Recorded: 2006-01-10
Pages: 3
Assignor
LEE, CHEONHEE
Executed: 2006-01-05
Assignee
CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CALIFORNIA, 94538
Covered Properties
(2)
Chip Scale Package Having Flip Chip Interconnect on Die Paddle
Flipchip-QFN integrated circuit system
Application:
60/628,525 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger and Change of Name
Aug 6, 2015
From: CHIPPAC, INC.; STATS CHIPPAC, INC.
To: STATS CHIPPAC, INC.
Reel/Frame 036286/0612 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →