IP Library › Assignment 017108/0774
Patent Assignment
Reel/Frame 017108/0774

Assignment of Assignor's Interest

Recorded: 2005-12-09 Pages: 3
Assignors
REISS, MARTIN
Executed: 2005-09-08
HETZEL, WOLFGANG
Executed: 2005-09-08
Assignee
INFINEON TECHNOLOGIES AG
ST. MARTIN STR. 53, MUNICH, 81669, GERMANY
Covered Property (1)
Stackable Single Package and Stacked Multi-Chip Assembly
Patent: 7,265,441 →
Application: 11/204,281 →
Publication: US 2007/0035006
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 13, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023773/0001 →
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest Sep 28, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036701/0926 →