Patent Assignment
Reel/Frame 017138/0033
Assignment of Assignor's Interest
Recorded: 2005-12-21
Pages: 9
Assignors
MIS, J. DANIEL
Executed: 2005-09-28
ADEMA, GRETCHEN
Executed: 2005-10-20
BUMGARNER, SUSAN
Executed: 2005-09-28
CHILUKURI, POOJA
Executed: 2005-10-20
RINNE, CHRISTINE
Executed: 2005-10-04
RINNE, GLENN
Executed: 2005-10-04
Assignee
UNITIVE INTERNATIONAL LIMITED
CARACASBAAIWEG 201, CURACAO, NETHERLANDS ANTILLES
Covered Property
(1)
Methods of Forming Lead Free Solder Bumps
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Effective 11/01/2012
Jan 9, 2013
From: UNITIVE INTERNATIONAL, LTD.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 029597/0452 →
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →