Patent Assignment
Reel/Frame 017269/0271
Assignment of Assignor's Interest
Recorded: 2006-03-07
Pages: 4
Assignors
CHOW, SENG GUAN
Executed: 2006-02-22
DO, BYUNG TAI
Executed: 2006-02-22
KUAN, HEAP HOE
Executed: 2006-02-22
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Wafer Level Chip Scale Package System with a Thermal Dissipation Structure
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0292 →
Release of Security Interest
Jun 11, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052907/0650 →
Correct Error in Assignment Name from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. (Reel: 038378 Frame: 0292)
Aug 30, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE.LTE.
Reel/Frame 064783/0896 →
Corrective Assignment to Correct the Assignee's Name on Coversheet from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded on Reel 038378 Frame 0292. Assignor(S) Hereby Confirms the Change of Name.
Sep 14, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064962/0123 →
Corrective Assignment to Correct the Assignee's Name on Cover Sheet from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded on Reel 064783 Frame 0896. Assignor(S) Hereby Confirms the Corrective Change of Name.
Sep 22, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 065015/0917 →