Patent Assignment
Reel/Frame 017513/0563
Assignment of Assignor's Interest
Recorded: 2005-08-15
Pages: 3
Assignors
ROTERS, GEORG
Executed: 2005-08-05
FRIGGE, STEFFEN
Executed: 2005-08-05
TAY, SING PIN
Executed: 2005-08-05
HU, YAO ZHI
Executed: 2005-08-05
HAYN, REGINA
Executed: 2005-08-05
SACHSE, JENS-UWE
Executed: 2005-08-05
SCHOER, ERWIN
Executed: 2005-08-05
KEGAL, WILHELM
Executed: 2005-08-05
Assignee
MATTSON THERMAL PRODUCTS GMBH
DAIMLERSTRASSE 10, DORNSTADT, D-89160, GERMANY
Covered Property
(1)
Device and Method for Thermally Treating Semiconductor Wafers
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 29, 2018
From: MATTSON THERMAL PRODUCTS GMBH
To: MATTSON TECHNOLOGY, INC.
Reel/Frame 045763/0296 →
Corrective Assignment to Correct the Patent Number 7037797 Previously Recorded at Reel: 045763 Frame: 0296. Assignor(S) Hereby Confirms the Assignment.
May 14, 2018
From: MATTSON THERMAL PRODUCTS GMBH
To: MATTSON TECHNOLOGY, INC.
Reel/Frame 046151/0332 →
Security Interest
Aug 27, 2018
From: MATTSON TECHNOLOGY, INC.
To: EAST WEST BANK
Reel/Frame 046956/0348 →
Assignment of Assignor's Interest
Sep 30, 2019
From: MATTSON TECHNOLOGY, INC.
To: MATTSON TECHNOLOGY, INC.; BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD
Reel/Frame 050582/0796 →
Release of Security Interest
Apr 15, 2021
From: EAST WEST BANK
To: MATTSON TECHNOLOGY, INC.
Reel/Frame 055950/0452 →