Patent Assignment
Reel/Frame 017578/0557
Assignment of Assignor's Interest
Recorded: 2005-11-18
Pages: 4
Assignors
JAKOB, ANDREAS
Executed: 2005-07-01
VISSING, KLAUS-D
Executed: 2005-06-10
STENZEL, VOLKMAR
Executed: 2005-06-10
Assignee
FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER
HANSASTR. 27C, MUCHEN, 80686, GERMANY
Covered Property
(1)
Method and Device for Machining a Wafer, in Addition to a Wafer Comprising a Separation Layer and a Support Layer
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 6, 2010
From: FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
To: THIN MATERIAL AG
Reel/Frame 024794/0617 →
Corrective Assignment to Correct the Assignee's Name from Thin Material Ag to Thin Materials Ag Previously Recorded on Reel 024794 Frame 0617. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Nov 29, 2011
From: FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
To: THIN MATERIALS AG
Reel/Frame 027291/0058 →
Nunc Pro Tunc Assignment
May 25, 2017
From: THIN MATERIALS GMBH
To: NISSAN CHEMICAL INDUSTRIES, LTD.
Reel/Frame 042505/0274 →
Assignment of Assignor's Interest
May 25, 2017
From: NISSAN CHEMICAL INDUSTRIES, LTD.
To: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Reel/Frame 042505/0436 →