IP Library › Assignment 024794/0617
Patent Assignment
Reel/Frame 024794/0617

Assignment of Assignor's Interest

Recorded: 2010-08-06 Pages: 2
Assignor
Assignee
THIN MATERIAL AG
ELSTERSTRASSE 23, EICHNAU, 82223, GERMANY
Covered Properties (2)
Method and Device for Machining a Wafer, in Addition to a Wafer Comprising a Separation Layer and a Support Layer
Patent: 7,482,249 →
Application: 10/536,725 →
Publication: US 2006/0166464
Method and Device for Machining a Wafer, in Addition to a Wafer Comprising a Separation Layer and a Support Layer
Patent: 8,173,522 →
Application: 12/359,730 →
Publication: US 2009/0176349
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 18, 2005
From: JAKOB, ANDREAS; VISSING, KLAUS-D; STENZEL, VOLKMAR
To: FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER
Reel/Frame 017578/0557 →
Corrective Assignment to Correct the Assignee's Name from Thin Material Ag to Thin Materials Ag Previously Recorded on Reel 024794 Frame 0617. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest. Nov 29, 2011
From: FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
To: THIN MATERIALS AG
Reel/Frame 027291/0058 →
Nunc Pro Tunc Assignment May 25, 2017
From: THIN MATERIALS GMBH
To: NISSAN CHEMICAL INDUSTRIES, LTD.
Reel/Frame 042505/0274 →
Assignment of Assignor's Interest May 25, 2017
From: NISSAN CHEMICAL INDUSTRIES, LTD.
To: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Reel/Frame 042505/0436 →